 W-6: 3D VSP - Recent Trends and the Road Ahead SEG 2012 Annual Meeting Technical Program
Date: Thursday, 8 November 2012
Time: 1:30 pm – 5:00 pm
Location: Mandalay Bay Convention Center, Room: Breakers L
Organizers: Jitendra Gulati, Denis Kiyashchenko, and Arthur Cheng
Through the support of the SEG Research Committee
Description
Recent resurgence in 3D VSP survey activity has been driven by interest in obtaining high-resolution seismic images, imaging of areas with complex overburden or sub-salt, reservoir monitoring applications of time-lapse borehole seismic, integration of 3D VSP with surface seismic data and their joint interpretation, and in the rock property evaluation using 3D VSP or walkaway VSP images. Longer array downhole tools, improved sources, optimally designed surveys, and faster turnaround times of 3D VSP imaging projects have raised the bar of the industry offerings. In this workshop, we would like to cover the latest acquisition, processing, imaging, and interpretation trends of modern 3D VSP applications. Recent developments in acquisition technology such as fiber-optic downhole recording, target-oriented Bayesian and Fresnel-based survey design, simultaneous sources are some of the acquisition-related topics. With increased computing power, it is possible to perform several iterations of model building and imaging. Additionally, there is growing interest in velocity model building using reflection tomography and full waveform inversion of 3D VSP data. In certain areas of the world, free-surface and inter-bed multiples attenuation remain on the priority list of things to be worked on 3D VSP data. There is also considerable interest in taking 3D VSP beyond imaging for rock properties evaluation. There is increasing interest in 3DVSP for time-lapse monitoring of different processes, such as EOR, oil production, and CO2 sequestration and the situations in which 3DVSP can be part of an optimal reservoir monitoring strategy. As the technology and the borehole seismic industry evolves, important questions need to be addressed to realize the full potential of 3D VSP data: - What is the additional information and value that the 3D VSP provides with respect to other forms of seismic data?
- Where does the industry stand when it comes to integrating 3D VSP and surface seismic data for both model building and imaging?
- What are the trends in tool technologies that can enable faster, cheaper and better 3D VSP data acquisition?
Schedule
1:30 pm: Introduction; Jitendra Gulati, Schlumberger; Denis Kiyashchenko, Shell; Arthur Cheng, Halliburton 1:40 pm: 3D VSP – the road ahead to achieving major business impact; Brian Hornby, BP 2:00 pm: Down but not out: Survey design to extend 3D VSP images; Robert R. Stewart, Emrah Pacal, and Tania Mukherjee, University of Houston 2:20 pm: 3D VSP for affordable permanent reservoir monitoring onshore and offshore; J. L. Lopez*, D. Kiyashchenko, A. Mateeva, J. Mestayer, W. Berlang, P. Wills, and B. Cox, Shell; G. Rocco and R. Adawi, PDO; D. Hill, P. Martin, and J. Roy, QinetiQ/OptaSense 2:40 pm: Discussion 3:10 pm: Distributed Acoustic Sensing / Break: Demonstration of Distributed Acoustic Sensing – Sudhendu Kashikar, Silixa
Distributed Acoustic Sensing – TBD, Optasense
Development of a DAS Seismic System – Graham Gaston, Fotech Solutions Ltd. 3:40 pm: How good are 3D/4D VSPs for waterflood surveillance?; Sudipta Sarkar, Steven Bahret, and Larry Sydora, Chevron 4:00 pm: More from 3DVSPs; Scott Leaney, Schlumberger 4:20 pm: Simultaneous 3D VSP and surface 3D seismic for volcanic reservoir exploration – a case study; Ling Yun, Guo Xiangyu*, Li Yanpeng, and Song Qianggong, BGP, CNPC 4:40 pm: Discussion and Wrap-up |
